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Catharina Rudolph, Fraunhofer IZM-ASSID, Dresden, Germany Program Co-Chair |
Catharina.Rudolph(@)assid.izm.fraunhofer.de |
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Imme Ellebrecht, ErzM-Technologies UG, Chemnitz, Germany Finance Co-Chair & General Team Manager |
Imme.Ellebrecht(@)erzm-tech.com |
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Anke Hanisch, Fraunhofer ENAS, Chemnitz, Germany Organizing Co-Chair |
Anke.Hanisch(@)enas.fraunhofer.com |
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Martin Kulawski, Advaplan Oy, Espoo, Finland Sponsoring Co-Chair |
Kulawski(@)advaplan-wafer.com |
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Gerfried Zwicker, CMP veteran, Berlin, Germany Program Co-Chair |
zwickerconsult(@)t-online.de |
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Benjamin Steible, Fraunhofer ISIT, Itzehoe, Germany Sponsoring Co-Chair |
Benjamin.Steible(@)isit.fraunhofer.de |
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Knut Gottfried, ErzM-Technologies UG & Fraunhofer ENAS, Chemnitz, Germany General Co-Chair |
Knut.Gottfried(@)erzm-tech.com |
The European CMP and WET Users Group is in close connection to the Users Groups from the United States, Japan, Korea, Taiwan, and China. Moreover, there is also a strong link to the International Conference on Planarization Technologies (ICPT). The following people represent Europe within the ICPT committees:
Program committee:
Eric Jaquinot, Merck Performance Materials, Trosly-Breuil, France
Catharina Rudolph, Fraunhofer IZM-ASSID, Dresden, Germany
Catherine Euvrard, CEA-Leti, Grenoble, France
Cedric Perrot, CEA-Leti, Grenoble, France
Executive committee
Patrick Ong, IMEC, Leuven, Belgium
Knut Gottfried, Fraunhofer ENAS & ErzM-Technologies UG, Chemnitz, Germany